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  • High-quality high-throughput silicon laser milling using a 1 kW sub-picosecond laser
High-quality high-throughput silicon laser milling using a 1 kW sub-picosecond laser

High-quality high-throughput silicon laser milling using a 1 kW sub-picosecond laser

Le 2021/06/28

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Logo Le fonds Europeen de développement régional et la Wallonie investissent dans votre avenir Construction du nouveau siège social et du centre de production de recherche de LASEA S.A.

Sectors

  • Watch industry & jewellery
  • Medical Devices
  • Electronic industry
  • R&D centers

Applications

  • Laser thin film removal
  • Laser structuring and texturing
  • Laser drilling
  • Laser cutting
  • Laser engraving
  • Laser marking

Products

  • Laser Machines
  • Softwares
  • Feasibility tests
  • Modules

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  • Sectors
    • Watch industry & jewellery
    • Medical Devices
    • Electronic industry
    • R&D centers
  • Applications
    • Laser thin film removal
    • Laser cutting
    • Laser engraving
    • Laser marking
    • Laser drilling
    • Laser structuring and texturing
  • Products
    • Laser Machines
      • LASEA neo
      • LS2
      • LS3
      • LS4
      • LS5
      • Optec LightShot LSV3
      • Optec ECHO 360 for wire stripping
      • Special machines
    • Softwares
      • KYLA™
      • LS-HMI
      • LS-PLUME
    • Modules
      • LS-Scan
      • LS-Shape
      • LS-Precess
      • LS-Lab
      • LS-View
    • Feasibility tests
  • References & partners
  • Company
    • History
    • A unique support
    • Our purpose
  • Contacts
  • Laser Machines
  • Jobs
  • News
  • FAQ
  • Videos
  • Brochures
  • Technotes
  • en
    • fr
    • de
  • Facebook
  • Twitter
  • Linkedin