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  • High-quality high-throughput silicon laser milling using a 1 kW sub-picosecond laser
High-quality high-throughput silicon laser milling using a 1 kW sub-picosecond laser

High-quality high-throughput silicon laser milling using a 1 kW sub-picosecond laser

Le 28/06/2021

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  • Applications
    • Laser thin film removal
    • Laser cutting
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    • Laser drilling
    • Laser structuring and texturing
  • Products
    • Laser Machines
      • LASEA neo
      • LS2
      • LS3
      • LS4
      • LS5
      • Optec LightShot LSV3
      • Optec ECHO 360 for wire stripping
      • Special machines
    • Softwares
      • KYLA™
      • LS-HMI
      • LS-PLUME
    • Modules
      • LS-Scan
      • LS-Shape
      • LS-Precess
      • LS-Lab
      • LS-View
    • Feasibility tests
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